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Low Profile Wire Wound Chip Inductor

1206AS

  L:3.3nH - 2200nH
SRF:160MHz - 6000MHz
DCR:0.05Ω - 4.50Ω
Rated DC Current:
    280mA - 1000mA
Material:Ceramic

PCN/PDN Archive

30 Jul 2007 - PISM Ferrite Core Material And Dimension Changed

12 Jul 2007 - 0603AS SPQ Per Reel Changed

03 May 2007 - Discontinue of Multilayer Inductors, Chip Beads & Some Molded Inductors

05 Feb 2007 - Discontinue of LMICC

01 Aug 2006 - PISG/L/M/N/R Eliminate Marking

09 May 2006 - 07M/07MFG Eliminate Marking

10 Apr 2006 - HBCC SPQ Per Box Changed

03 Apr 2006 - PISL/N/R SPQ Per Reel Changed

25 Jan 2006 - PISL/M/N/R Manufacturing Process Changed

29 Nov 2005 - PISL/M/N/R Epoxy Type Changed

11 Oct 2005 - SMD Power Inductor Design Changed

23 Sept 2002 - VDE Zeichen - Entstördrosseln der Serien MISC, MESC, SMSC, LASC, SSSC, MSSC & LSSC